DesignationTechnical LeadNo. of Positions1Skill (Primary)Technical Skills (ERS)-Electronics V&V-CAdence: PCB DesignJob FamilyArchitecture / Design (Posting).7+ Years industry experience with Allegro tool from setting up layout constraints, placement, routing and releasing to fab. Able to create symbol and footprint. Ability to design large, complex multilayer PCBs with various stack up topologies.Ability to define stack up and work closely with PCB house.Experience with Type3 and Type4 PCBs design.Experience with DDR, Ethernet, high speed, analog, RF and controlled impedance routing.Knowledge of PCB manufacturing process, DFM and DFT. Knowledge of PCB technology (back drilling, micro vias, blind via, buried via, stacked via, staggered via, etc).Ability to read and understand electronic schematics. (1.) To collaborate with key stakeholders, to understand business objectives and work with them to integrate design thinking into softwareorproduct development. (2.) To lead a team of designers, provide guidance, and ensuring the delivery of high-quality design solutions in alignment with the overall business goals. (3.) To present design concepts and strategies to stakeholders and gather feedback. (4.) To establish and maintain design standards, guidelines, and best practices. (5.) To stay abreast of industry trends, emerging technologies to drive innovation and excellence in design.Skill Level 3 (Secondary Skill 1)Tools and Standards (ERS)-ECAD Tools-ALLEGRO PCBSkill Level 3 (Secondary Skill 2)Technical Skills (ERS)-HW Board-Test/Interface/uC Board Design
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