:Our vision is to transform how the world uses information to enrich life for all.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.This role is within Package and Development Engineering (PDE) group of Micron. This is a global department with teams located in USA, Singapore, Malaysia, Taiwan, and India. As a PDPE (Package Device Product Engineer) in PDE, you will be responsible to prepare for new DRAM, NAND or MNAND products and coordinate resources, testing, and analysis over the lifecycle of the product. You will run data analysis and modelling, create, and maintain root cause analysis documentation, analyze parametric, probe level (Front End) and electrical test (Back End) data and respond to failures. In this role, you will work with various Technology Development (TD) & New Product Introduction (NPI) Engineering (Electrical Failure Analysis (EFA), Physical Failure Analysis (PFA), Assembly) and Manufacturing groups to find the root causes of the failed units.Responsibilities and Tasks
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