and Requirements:This job is for a 3DIC thermal design engineer; In this role, the engineer will be a part of a team that designs cutting edge packaging solutions for industry\'s leading 3DIC customers in the datacenter, AI/ML space. The candidate will evaluate the design tradeoffs by running thermal simulations to ensure the design is ready for sign-off. Experience in thermal analysis and modeling of thermal conduction, convection and radiation and how to setup simulation environment with proper boundary conditions is required.An in-depth understanding of thermal analysis fundamentals is required to successfully architect plans for modeling of multiple side-by-side and stacked devices on the silicon interposers with chiplets and optical components. Need to work cross functionally with Synopsys\' IP teams to translate the industry\'s largest IP portfolio of memory and SerDes IP\'s thermal specifications into design requirements. The ideal candidate should be self-motivated, detail-oriented, and have strong coordination and partnership skills.Qualifications
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