Senior Assembly Equipment Engineer Die Attach

Year    India, India

Job Description


Our vision is to transform how the world uses information to enrich life for . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. JR39180 Senior Assembly Equipment Engineer - Die Attach (Evergreen) As a Die Attach Equipment Engineer, you will be o versees the installation, modification, upgrade and maintena nce of manufacturing equipment including s tudies equipmen t performance and reliability to ensure production equipment is in control and quality of product is meeting expectation sustaining and improving key performance indices of the equipment through continuous i mprovement activities reducing cost through qualifying 2 nd source ensuring effective and efficient equipment ris k management strategy continuous develop new capabilities ahead of needs. Responsibilities and Tasks : Implement Preventive/ Predictive maintenance program Develop equipment maintenance specification Monitor equipment performance key indicators and responsible t o meet expectation Provide necessary production support Establish spare inventory system for key equipment Monitor spare cost and drive down liabilities of spare inventories Work with Purchasing to identify critical suppliers and develop 2nd sourcing strategy Identify the key cost drivers and work on cost reduction programs Define, develop and maintain equipment capabilities, strategy and roadmap Maintain ing a matrix on equipment capabilities and constraints Work with equipment suppliers to develop new material / capabilities Regularly conduct equipment benchmarking exercise Work with equipment suppliers to develop new capability Work with Package Development team to establish production capabilities for new products Requirements: Master / Degree in Mechanical, Mechatr onics, Electrical & Electronics or related Engineering Minimum 3 years of working experience in semiconductor industry. Knowledge in Die Attach, Devoid/oven curing will be added advantages. Excellent interpersonal, communication and leadership skill with an extremely positive attitude towards working as a team. Broad technical knowledge in problem solving analytical skill & lead an engineering team through innovative process implementation (FMEA, DOE, FDC/APC , DATA ANALYSIS) Self-motivated, possess initiative and ability to work independently Team player with good communication and interpersonal skills

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Job Detail

  • Job Id
    JD3108453
  • Industry
    Not mentioned
  • Total Positions
    1
  • Job Type:
    Full Time
  • Salary:
    Not mentioned
  • Employment Status
    Permanent
  • Job Location
    India, India
  • Education
    Not mentioned
  • Experience
    Year