: Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron?s Signal Integrity Research and Development (SI R&D) group supports all current and future product development, including DRAM, LPDRAM, NAND, NOR, 3DXP, DIMM modules and SSDs within the consumer, server, mobile, networking, graphics, automobile and embedded businesses. The SI R&D group works on analysis of end to end systems solutions including, but not limited to circuit level IO and Power Distribution, integrated circuit (IC) packages, printed circuit boards (PCBs) and measurements to ensure good Signal Integrity (SI) and power integrity (PI) performance for Micron?s memory solutions. The group owns all steps of the signal and power integrity support process including die IO and package model generation, product performance analysis, system-level SI evaluation, measurement, correlation, and customer support. The group also supports future specification development within several industry standards groups including but not limited to JEDEC, ONFI, and IBIS. The group working environment is technically challenging, team-oriented, collaborative and customer-centric. Within the larger SI R&D group, as an Engineer in the Signal Integrity team at Micron, you will be responsible for Working on various aspects of SI and PI for high speed interfaces, including modeling (silicon, package and board level signal and power delivery network, as necessary for the project), time and frequency domain analysis for SI and PI electrical performance evaluation of Micron products and correlation to measurement for the various products. Ensuring that processes for various methodologies are executed effectively and accurately. Collaborating with TMs within the global SIRD group for development and continued optimization of methodologies for modeling and analysis as needed. Representing the SI R&D team in technical cross functional collaborative groups, and integrating with package design, silicon design, product engineering, and marketing departments to ensure overall product performance. Occasionally Supporting FAE, applications engineers with models for service to external customer as needed Occasionally Supporting path-finding activities through modeling support Qualifications Successful candidates for this position will have:
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