High-Density Interconnect PCBs have a higher wiring density per unit area than conventional PCB and is utilized in complex small form factor designs. This advancement in PCB design is being driven by the miniaturization of components and semiconductor packages that supports advanced features that are getting utilized in revolutionary new products like wearable electronics, touch screen computing, compact, small footprint gadgets, defense, and aerospace applications. Mistral\xe2\x80\x99s expert team has extensive experience in offering High-Density Interconnect PCB designs including microvias, blind and buried vias, fine lines, and spaces, sequential lamination, via-in-pad technology-based techniques. Mandatory Requirements

• PCB Layout Engineer with hands-on Knowledge in High-Speed Designs
• Knowledge on PCB Footprints
• Designed Complex High-Speed Layouts.
• Worked on HDI PCB Layouts
• Flexible to Work on shift

The below Pre Requisites are Required to be successful in the above Organizational Role. Preferable

• Layout Using Allegro and Orcad Capture for schematics
• Altium and Pad are optional